2UUL Precision Fixed Needle IC Heating Degumming Fixture Mini Portable Stand For Mobile Mainboard Chip Glue Residue Removal Jobs

2UUL FD40 Find 210 Mini Chip Heating Glue Removal Station IC Adhesive Removing Cleaner for Mobile Phone Board Repair Tool 2UUL Find 210 Chip Heating Glue Removal Station | The Ultimate Precision Tool for BGA Repair The 2UUL Find 210 is a compact, precision-engineered heating station designed specifically for removing stubborn glue around BGA IC chips. With adjustable heat control and a slim probe, it delivers safe, targeted heating to soften adhesive without damaging delicate components. Core Product Highlights ️ Precision Heating for Safe Glue Removal The Find 210 heats up to 200°C, softening even the most stubborn adhesive around chips. This makes scraping and cleaning glue easy, without risking thermal damage to your ICs or motherboard. Fine-Tuned Control for Every Job The adjustable screw lets you precisely control the probe’s position and pressure, ensuring consistent, even heat transfer every time. Whether you’re working on large or tiny chips, you get perfect results. Ultra-Slim Probe for Tight Spaces The thin, precision probe reaches between chips and under components, where standard tools can’t fit. This lets you target glue in hard-to-reach areas without disassembling the entire board. Compact, Lightweight & Portable At just 7g and palm-sized, the Find 210 won’t take up space on your workbench. It’s lightweight enough to hold in one hand, and easy to carry to repair jobs or store when not in use. ️ Engineered for Safety & Reliability The station is built for stable, controlled heating to prevent overheating. Its consistent performance ensures you get the same results every time, even with repeated use. ️ Designed for Professional Repair Work Whether you’re a seasoned technician or a hobbyist, the Find 210 simplifies glue removal on BGA chips, CPU modules, and other high-precision components. It’s a must-have for any serious repair toolkit. Wide Application Scenarios Removing residual glue from BGA IC chips on mobile phone and tablet motherboards Softening adhesive around CPU, RAM, and other precision components Cleaning stubborn flux and glue after soldering/desoldering Professional repair shops and hobbyist workstations Electronics maintenance where controlled, targeted heating is needed