MECHANIC 183℃ Solder Tin Paste Sn63/Pb37 BGA Reballing Welding Flux Soldering Cream for Mobile Phone IC CPU SMD PCB Rework Tools

MECHANIC 183℃ Solder Tin Paste Sn63/Pb37 BGA Reballing Welding Flux Soldering Cream for Mobile Phone IC CPU SMD PCB Rework ToolsSpecification : --Brand : MECHANIC.--Model : XGZ40/XGSP30/XGSP40/XGSP50/XGSP80.--Type : Tin Paste .--Weight : 20g/35g/42g/60g.--Microns : 20-38um.--Melting Point : 183℃.--Great Soldering Rework Tools for Smart Phone, PCB, BGA, Motherboard Repairing. --WARNING: This product can expose you to chemicals including lead, which is known to the State of California to cause cancer and birth defects or other reproductive harm. For more information go towww.P65Warnings.ca.gov.Package :1 * Solder Tin Paste

GlobalTechMart

GlobalTechMart

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