Heavy Duty SXM2 GPU Expansion Module Supporting 300G Thermals Design For AI And HPC Applications

Engineered for performances, the SXM2 two GPU expansion baseboard 300G supports two SXM2 GPUs V100 with integrated NVLink interconnect, delivering low latency communication and 300W thermal capacity for uninterrupted high performances computing and AI workloads. Features two SXM2 interfaces eliminating PCIe slots for dense GPU deployment, coupled with centralized 300G cooling systems and server specific compatibility, ensuring optimal stability in data intensive tasks like distributed AI training and HPC clusters. for enterprises data centers, research institutions, and AI developers requiring maximized computational densities for GPU accelerated workloads such as deeply learning model training, physics simulations, and large scale data analytics. Heavy Duty SXM2 GPU Expansion Module Supporting 300G Thermals Design For AI And HPC Applications. Features: Engineered for performances, the SXM2 two GPU expansion baseboard 300G supports two SXM2 GPUs V100 with integrated NVLink interconnect